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SFT825N-S View Datasheet(PDF) - SEOUL SEMICONDUCTOR

Part Name
Description
Manufacturer
SFT825N-S Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
12. Reliability Test Item and Condition
Item
Thermal Shock
Temperature
Cycle
High
Temperature
Storage
High
Temperature
High Humidity
Storage
Low
Temperature
Storage
Operating
Endurance Test
High
Temperature
High Humidity
Life Test
High
Temperature
Life Test
Low
Temperature
Life Test
ESD(HBM)
Reference
EIAJ ED-
4701
EIAJ ED-
4701
EIAJ ED-
4701
EIAJ ED-
4701
EIAJ ED-
4701
Internal
Reference
Internal
Reference
Internal
Reference
Internal
Reference
MIL-STD-
883D
Test Condition
Ta =-40oC (30MIN) ~ 100oC
(30MIN)
Duration
/ Cycle
100
Cycle
Number
of
Damage
0/22
Ta =-40oC (30MIN) ~ 25oC (5MIN) 100
~ 100oC (30MIN) ~ 25oC (5MIN) Cycle
0/22
Ta =100oC
1000
Hours
0/22
Ta =85oC, RH=85%
1000
Hours
0/22
Ta =-40oC
Ta =25oC, IF =20mA
Ta =85oC, RH=85%, IF =15mA
1000
Hours
1000
Hours
300
Hours
0/22
0/22
0/22
Ta =85oC, IF =20mA
Ta =-40oC, IF =20mA
1KV at 1.5k; 100pF
500
Hours
1000
Hours
3 Time
0/22
0/22
0/22
Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
VF
IF =20mA
Reverse Current
IR
Luminous
Intensity
IV
VR=5V
IF =20mA
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
Criteria for Judgement
MIN
MAX
-
USL*1 × 1.2
-
USL*1 × 2.0
LSL*2 × 0.5
-
Rev. 07
June 2009
www.acriche.com
Document No. : SSC-QP-7-07-24 (Rev.00)

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