MC7410VU400LE View Datasheet(PDF) - Unspecified
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MC7410VU400LE Datasheet PDF : 56 Pages
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Electrical and Thermal Characteristics
Table 4. Package Thermal Characteristics (continued)
Characteristic
Value
Symbol MPC7410 MPC7410 Unit Notes
CBGA
HCTE
Junction-to-case thermal resistance
RθJC
< 0.1
< 0.1
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
4. Thermal resistance between the active portion of the die and the calculated case temperature at the top of the die.
The actual value of R JC is less than 0.1 °C/W.
Note: Refer to Section 8.8, “Thermal Management Information,” for details on thermal management.
Table 5 provides the DC electrical characteristics for the MPC7410.
Table 5. DC Electrical Specifications
At recommended operating conditions (see Table 3)
Nominal
Characteristic
Bus Symbol
Min
Max
Voltage1
Input high voltage (all inputs except
1.8
SYSCLK)
2.5
3.3
Input low voltage (all inputs except
1.8
SYSCLK)
2.5
3.3
SYSCLK input high voltage
1.8
2.5
3.3
SYSCLK input low voltage
1.8
2.5
3.3
Input leakage current,
1.8
Vin = L2OVDD/OVDD
2.5
3.3
VIH
VIH
VIH
VIL
VIL
VIL
CVIH
CVIH
CVIH
CVIL
CVIL
CVIL
Iin
Iin
Iin
0.65 × (L2)OVDD
1.7
2.0
–0.3
–0.3
–0.3
(L2)OVDD + 0.2
(L2)OVDD + 0.2
OVDD + 0.3
0.35 × (L2)OVDD
0.2 × (L2)OVDD
0.8
1.5
2.0
2.4
–0.3
OVDD + 0.2
OVDD + 0.2
OVDD + 0.3
0.2
–0.3
0.4
–0.3
0.4
—
20
—
35
—
70
Unit
V
V
V
V
µA
Notes
2, 3, 8
8
2, 8
8
2, 3,
6, 7
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
11
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