TS4962MEIJT(2005) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

TS4962MEIJT
(Rev.:2005)

3W Filter-free Class D Audio Power Amplifier

STMicroelectronics 

TS4962M

8 Package Mechanical Data

Package Mechanical Data

9-bump flip-chip

Figure 67. Pin-out for 9-bump flip-chip (top view)

IN+

1/A1

VDD

4/B1

IN-

7/C1

GND

2/A2

VDD

5/B2

STBY

8/C2

OUT-

3/A3

GND

6/B3

OUT+

9/C3

■ Bumps are underneath

■ Bump diameter = 300µm

Figure 68. Marking for 9-bump flip-chip (top view)

E

XXX

YWW

■ ST Logo

■ Symbol for lead-free: E

■ Two first XX product code: 62

■ third X: Assembly code

■ Three digits date code: Y for year - WW for week

■ The dot is for marking pin A1

Figure 69. Mechanical data for 9-bump flip-chip

1.60 mm

■ Die size: 1.6mm x 1.6mm ±30µm

■ Die height (including bumps): 600µm

■ Bump diameter: 315µm ±50µm

1.60 mm ■ Bump diameter before reflow: 300µm ±10µm

0.5mm

■ Bump height: 250µm ±40µm

■ Die height: 350µm ±20µm

0.5mm

∅ 0.25mm

■ Pitch: 500µm ±50µm

■ Coplanarity: 50µm max

600µm

31/32

Share Link: