MPC8349E View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MPC8349E Datasheet PDF : 88 Pages
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Power Characteristics
3 Power Characteristics
The estimated typical power dissipation for the MPC8349E device is shown in Table 4.
Table 4. MPC8349E Power Dissipation1
Core
Frequency
(MHz)
CSB
Frequency
(MHz)
Typical at TJ = 65 Typical2, 3 Maximum4
Unit
TBGA
333
333
2.0
3.0
3.2
W
166
1.8
2.8
2.9
W
400
266
2.1
3.0
3.3
W
133
1.9
2.9
3.1
W
450
300
2.3
3.2
3.5
W
150
2.1
3.0
3.2
W
500
333
2.4
3.3
3.6
W
166
2.2
3.1
3.4
W
533
266
2.4
3.3
3.6
W
133
2.2
3.1
3.4
W
1 The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 5.
2 Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
3 Thermal solutions may need to design to a value higher than typical power based on the end application, TA target, and I/O
power.
4 Maximum power is based on a voltage of VDD = 1.2 V, worst case process, a junction temperature of TJ= 105°C, and an artificial
smoke test.
MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
10
Freescale Semiconductor
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