DSP56KFAMUM/AD(1996) View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
DSP56KFAMUM/AD Datasheet PDF : 110 Pages
| |||
Specifications
Thermal characteristics
Table 2-1 Absolute Maximum Ratings (GND = 0 V)
Rating
Supply Voltage
All Input Voltages
Current Drain per Pin excluding VCC and GND
Operating Temperature Range
Storage Temperature
Symbol
VCC
VIN
I
TJ
Tstg
Value
–0.3 to +7.0
(GND – 0.5) to (VCC + 0.5)
10
–40 to +105
–55 to +150
Unit
V
V
mA
°C
°C
THERMAL CHARACTERISTICS
Table 2-2 Thermal Characteristics
Characteristic
Symbol
PQFP
Value3
TQFP
Value3
TQFP
Value4
PGA
Value3
Unit
Junction-to-ambient
thermal resistance1
RθJA or θJA
50
48
40.6
22
˚C/W
Junction-to-case
thermal resistance2
RθJC or θJC
12.4
10.8
—
6.5
˚C/W
Thermal
characterization
parameter
ΨJT
4.0
0.16
—
N/A
˚C/W
Notes: 1. Junction-to-ambient thermal resistance is based on measurements on a horizontal-single-sided
Printed Circuit Board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment and
Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111)
Measurements were made with the parts installed on thermal test boards meeting the specification
EIA/JEDECSI-3.
2. Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88,
with the exception that the cold plate temperature is used for the case temperature.
3. These are measured values. See note 1 for test board conditions.
4. These are measured values; testing is not complete. Values were measured on a non-standard four-
layer thermal test board (two internal planes) at one watt in a horizontal configuration.
2-2
DSP56002/D, Rev. 3
MOTOROLA
Share Link: 