DSP56311 View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
DSP56311 Datasheet PDF : 96 Pages
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Specifications
2.2 Thermal Characteristics
Table 2-2. Thermal Characteristics
Thermal Resistance Characteristic
Symbol
MAP-BGA
Value
Unit
Junction-to-ambient, natural convection, single-layer board (1s)1,2
Junction-to-ambient, natural convection, four-layer board (2s2p)1,3
Junction-to-ambient, @200 ft/min air flow, single layer board (1s)1,3
Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p)1,3
Junction-to-board4
Junction-to-case thermal resistance5
Junction-to-package-top, natural convection6
Junction-to-package-top, @200 ft/min air flow6
RθJA
RθJMA
RθJMA
RθJMA
RθJB
RθJC
ΨJT
ΨJT
49
°C/W
26
°C/W
39
°C/W
22
°C/W
14
°C/W
5
°C/W
2
°C/W
2
°C/W
Notes: 1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
DSP56311 Technical Data, Rev. 8
2-2
Freescale Semiconductor
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