DSP56300FM View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
DSP56300FM Datasheet PDF : 148 Pages
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Thermal Characteristics
Table 3-1 Maximum Ratings
Rating1
Symbol
Value1, 2
Unit
Supply Voltage
All input voltages excluding “5 V tolerant” inputs3
All “5 V tolerant” input voltages3
VCC
−0.3 to +4.0
V
VIN
GND -0.3 to VCC + 0.3
V
VIN5
GND − 0.3 to VCC + 3.95
V
Current drain per pin excluding VCC and GND
I
10
mA
Operating temperature range
TJ
-40 to +105
°C
Storage temperature
TSTG
−55 to +125
°C
1 GND = 0 V, VCC = 3.3 V ± 0.16 V, TJ = –0°C to +105°C, CL = 50 pF
2 Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
3 CAUTION: All “5 V Tolerant” input voltages must not be more than 3.95 V greater than the supply voltage; this restriction
applies to “power on”, as well as during normal operation. In any case, the input voltages cannot be more than 5.75 V. “5 V
Tolerant” inputs are inputs that tolerate 5 V.
3.3 Thermal Characteristics
Table 3-2 Thermal Characteristics
Characteristic
Symbol
TQFP Value
Unit
Junction-to-ambient thermal resistance1
RθJA or θJA
49.87
°C/W
Junction-to-case thermal resistance2
RθJC or θJC
9.26
°C/W
Thermal characterization parameter
ΨJT
2.0
°C/W
1 Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per SEMI
G38-87 in natural convection. (SEMI is Semiconductor Equipment and Materials International, 805 East Middlefield Rd.,
Mountain View, CA 94043, (415) 964-5111.)
Measurements were done with parts mounted on thermal test boards conforming to specification EIA/JESD51-3.
2 Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that
the cold plate temperature is used for the case temperature.
DSP56364 Technical Data, Rev. 4.1
3-2
Freescale Semiconductor
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