DSP56366 View Datasheet(PDF) - Freescale Semiconductor
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DSP56366 Datasheet PDF : 110 Pages
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Table 3-1 Maximum Ratings (continued)
Rating1
Symbol
Value1, 2
Unit
Operating temperature range
TJ
−40 to +110
°C
Storage temperature
TSTG
−55 to +125
°C
1 GND = 0 V, VCC = 3.3 V ± 0.16 V, TJ = –40°C to +110°C, CL = 50 pF
2 Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
3 CAUTION: All “5 V Tolerant” input voltages must not be more than 3.95 V greater than the supply voltage; this restriction
applies to “power on”, as well as during normal operation. In any case, the input voltages cannot be more than 5.75 V. “5 V
Tolerant” inputs are inputs that tolerate 5 V.
3.3 Thermal Characteristics
Table 3-2 Thermal Characteristics
Characteristic
Symbol
LQFP Value
Unit
Junction-to-ambient thermal resistance1, 2 Natural Convection
RθJA or θJA
37
°C/W
Junction-to-case thermal resistance3
RθJC or θJC
7
°C/W
Thermal characterization parameter4 Natural Convection
ΨJT
2.0
°C/W
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
DSP56366 Technical Data, Rev. 3.1
3-2
Freescale Semiconductor
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