IMX51 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

IMX51

i.MX51 Applications Processors for Consumer and Industrial Products

Freescale Semiconductor 

Electrical Characteristics

Table 11. Absolute Maximum Ratings

Parameter Description

Symbol

Min

Max

Unit

Peripheral Core Supply Voltage

VCC

–0.3

1.35

V

ARM Core Supply Voltage

Supply Voltage (UHVIO, I2C)

Supply Voltage (except UHVIO, I2C)

VDDGP

–0.3

1.15

V

Supplies denoted as I/O Supply –0.5

3.6

V

Supplies denoted as I/O Supply –0.5

3.3

V

USB VBUS

VBUS

—

5.25

V

Input/Output Voltage Range

Vin/Vout

–0.5

OVDD + 0.31

V

ESD Damage Immunity:

Vesd

V

Human Body Model (HBM)

Charge Device Model (CDM)

—

2000

—

500

Storage Temperature Range

TSTORAGE

–40

125

oC

Junction Temperature (MCIMX51xD—Consumer)

TJ

—

105

oC

Junction Temperature (MCIMX51xC—Industrial)

TJ

—

105

oC

1 The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in

Table 128 and Table 131. The maximum range can be superseded by the DC tables.

Table 12 provides the thermal resistance data.

Table 12. Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Case1, 19 x 19 mm package

—

RθJC

6

°C/W

Junction to Case1, 13 x 13 mm package

—

RθJC

6

°C/W

1 Rjc-x per JEDEC 51-12: The junction-to-case thermal resistance. The “x” indicates the case surface where Tcase is measured

and through which 100% of the junction power is forced to flow due to the cold plate heat sink fixture placed either at the top (T)

or bottom (B) of the package, with no board attached to the package.

i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 6

18

Freescale Semiconductor

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