MPC8540 View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
MPC8540 Datasheet PDF : 104 Pages
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Power Characteristics
Table 4. MPC8540 VDD Power Dissipation 1,2
CCB Frequency
(MHz)
Core
Frequency (MHz)
Typical Power3,4
Maximum
Power5
Unit
333
667
6.3
9.3
W
833
1000 6
6.9
11.3
10.9
15.9
Notes:
1. The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD.
2. Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, air flow, power dissipation of other
components on the board, and board thermal resistance. Any customer design must take
these considerations into account to ensure the maximum 105 °C junction temperature is
not exceeded on this device.
3. Typical Power is based on a nominal voltage of VDD = 1.2 V, a nominal process, a junction
temperature of Tj = 105 °C, and a Dhrystone 2.1 benchmark application.
4. Thermal solutions will likely need to design to a number higher than Typical Power based on
the end application, TA target, and I/O power.
5. Maximum power is based on a nominal voltage of VDD = 1.2 V, worst case process, a junction
temperature of Tj = 105 °C, and an artificial smoke test.
6. The nominal recommended VDD is 1.3 V for this speed grade.
The estimated power dissipation on the AVDD supplies for the MPC8540 PLLs is shown in Table 5.
Table 5. MPC8540 AVDD Power Dissipation
AVDDn
Typical1
Unit
AVDD1
0.007
W
AVDD2
0.014
W
Notes:
1. VDD = 1.2 V (1.3 V for 1.0 GHz device), TJ = 105°C
Table 6 provides estimated I/O power numbers for each block: DDR, PCI, Local Bus, RapidIO, TSEC, and
FEC.
Table 6. Estimated Typical I/O Power Consumption
Interface
DDR I/O
Parameter
CCB = 200 MHz
CCB = 266 MHz
CCB = 300 MHz
CCB = 333 MHz
GVDD (2.5 OVDD (3.3
V)
V)
0.46
0.59
0.66
0.73
LVDD (3.3
V)
LVDD (2.5
V)
Units
W
Notes
1
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
12
Freescale Semiconductor
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