Figure 11: 86-Ball FBGA – x4, x8 (BY)
1Gb: x4, x8, x16 DDR3 SDRAM
Package Dimensions
Seating
plane
0.12 A
A
86X Ø0.45
Solder ball
material: SAC305.
Dimensions apply
to solder balls
post-reflow on
Ø0.33 NSMD ball
pads.
987
0.8 ±0.1
321
Ball A1 ID
A
0.8 TYP
14.4 CTR
2.4
D
E
F
G
H
J
K 15.5 ±0.15
L
M
N
P
R
T
W
0.8 TYP
6.4 CTR
9 ±0.15
Note: 1. All dimensions are in millimeters.
Ball A1 ID
1.2 MAX
0.25 MIN
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN
27
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.