Figure 12: 96-Ball FBGA – x16 (LA)
1Gb: x4, x8, x16 DDR3 SDRAM
Package Dimensions
Seating
plane
0.12 A
A
96X Ø0.45
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
987
12 CTR
0.8 TYP
0.8 ±0.1
321
Ball A1 ID
A
B
C
D
E
F
G
H 15.5 ±0.15
J
K
L
M
N
P
R
T
0.8 TYP
6.4 CTR
9 ±0.15
Note: 1. All dimensions are in millimeters
Ball A1 ID
1.2 MAX
0.25 MIN
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN
28
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