Package Information
5 Package Information
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Features are symmetrical about
the package center lines unless
dimensioned otherwise.
4. Maximum solder ball diameter
measured parallel to Datum A.
5. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
6. Parallelism measurement shall
exclude any effect of mark on
top surface of package.
7. Capacitors may not be present
on all devices.
8. Caution must be taken not to
short capacitors or exposed
metal capacitor pads on
package top.
9. FC CBGA (Ceramic) package
code: 5238.
FC PBGA (Plastic) package
code: 5263.
10.Pin 1 indicator can be in the
form of number 1 marking or an
“L” shape marking.
Figure 35. MSC8122 Mechanical Information, 431-pin FC-PBGA Package
6 Product Documentation
• MSC8122 Technical Data Sheet (MSC8122). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8122 device.
• MSC8122 Reference Manual (MSC8122RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
• Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8122 device.
• SC140 DSP Core Reference Manual. Covers the SC3400 core architecture, control registers, clock registers, program
control, and instruction set.
MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 15
44
Freescale Semiconductor