STM32F031C4Y6 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F031C4Y6

ARM®-based 32-bit MCU with up to 32 Kbyte Flash, 9 timers, ADC and communication interfaces, 2.0 - 3.6 V

STMicroelectronics 

Package information

STM32F031x4 STM32F031x6

Symbol

Table 65. WLCSP25 package mechanical data (continued)

millimeters

inches(1)

Min

Typ

Max

Min

Typ

aaa

-

0.100

-

bbb

-

0.100

-

ccc

-

0.100

-

ddd

-

0.050

-

eee

-

0.050

-

-

0.0039

-

0.0039

-

0.0039

-

0.0020

-

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Back side coating.

3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

4. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

Figure 44. Recommended footprint for WLCSP25 package

'SDG

'VP

Max

-

-

-

-

-

:/&63B$1B)3B9

Table 66. WLCSP25 recommended PCB design rules

Dimension

Recommended values

Pitch

0.4 mm

Dpad

0.225 mm

Dsm

0.290 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.250 mm

Stencil thickness

0.100 mm

94/106

DocID025743 Rev 6

Share Link: