STM32F031x4 STM32F031x6
Package information
Symbol
Table 67. TSSOP20 package mechanical data (continued)
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
k
0°
-
8°
0°
-
8°
aaa
-
-
0.100
-
-
0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per side.
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25mm per side.
Figure 47. Recommended footprint for TSSOP20 package
1. Dimensions are expressed in millimeters.
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