STM32F031C4Y6 Datasheet PDF - STMicroelectronics

STM32F031C4Y6 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F031C4Y6

STMicroelectronics

STM32F031C4Y6 Datasheet PDF : 106 Pages

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STM32F031x4 STM32F031x6

Package information

7.7

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 18: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 68. Package thermal characteristics

Symbol

Parameter