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MPC8349VVAGDB View Datasheet(PDF) - Freescale Semiconductor

Part Name
Description
Manufacturer
MPC8349VVAGDB Datasheet PDF : 87 Pages
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Power Characteristics
2 Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
3 Thermal solutions may need to design to a value higher than typical power based on the end application, TA target, and I/O
power.
4 Maximum power is based on a voltage of VDD = 1.2 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
5 Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
6 Maximum power is based on a voltage of VDD = 1.3 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
Table 5 shows the estimated typical I/O power dissipation for MPC8349EA.
Table 5. MPC8349EA Typical I/O Power Dissipation
Interface
Parameter
DDR I/O
65% utilization
2.5 V
Rs = 20 Ω
Rt = 50 Ω
2 pair of clocks
200 MHz, 32 bits
200 MHz, 64 bits
266 MHz, 32 bits
266 MHz, 64 bits
300 MHz, 32 bits
300 MHz, 64 bits
333 MHz, 32 bits
333 MHz, 64 bits
400 MHz, 32 bits
400 MHz, 64 bits
PCI I/O
load = 30 pF
33 MHz, 64 bits
66 MHz, 64 bits
33 MHz, 32 bits
66 MHz, 32 bits
Local bus I/O
load = 25 pF
133 MHz, 32 bits
83 MHz, 32 bits
66 MHz, 32 bits
50 MHz, 32 bits
TSEC I/O
load = 25 pF
MII
GMII or TBI
RGMII or RTBI
USB
12 MHz
480 MHz
Other I/O
GVDD
(1.8 V)
0.31
0.42
0.35
0.47
0.37
0.50
0.39
0.53
0.44
0.59
GVDD
(2.5 V)
0.42
0.55
0.5
0.66
0.54
0.7
0.58
0.76
OVDD
(3.3 V)
0.08
0.14
0.04
0.07
0.27
0.17
0.14
0.11
0.01
0.2
0.01
LVDD
(3.3 V)
0.01
0.06
LVDD
(2.5 V)
0.04
Unit
Comments
W
W
W
W
W
W
W
W
W
W
W Multiply by 2 if using
2 ports.
W
W
W
W
W
W Multiply by number of
interfaces used.
W
W
W Multiply by 2 if using
2 ports.
W
W
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
11

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