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MPC8541CPXAJD(2006) View Datasheet(PDF) - Freescale Semiconductor

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MPC8541CPXAJD Datasheet PDF : 84 Pages
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4 Clock Timing
Clock Timing
4.1 System Clock Timing
Table 6 provides the system clock (SYSCLK) AC timing specifications for the MPC8541E.
Table 6. SYSCLK AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
SYSCLK frequency
SYSCLK cycle time
SYSCLK rise and fall time
SYSCLK duty cycle
SYSCLK jitter
fSYSCLK
tSYSCLK
6.0
tKH, tKL
0.6
tKHK/tSYSCLK
40
166
MHz
1
ns
1.0
1.2
ns
2
60
%
3
+/- 150
ps
4, 5
Notes:
1. Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
frequencies.
2. Rise and fall times for SYSCLK are measured at 0.6 V and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. For spread spectrum clocking, guidelines are +/-1% of the input frequency with a maximum of 60 kHz of modulation
regardless of the input frequency.
4.2 TSEC Gigabit Reference Clock Timing
Table 7 provides the TSEC gigabit reference clock (EC_GTX_CLK125) AC timing specifications for the
MPC8541E.
Table 7. EC_GTX_CLK125 AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
EC_GTX_CLK125 frequency
fG125
125
MHz
EC_GTX_CLK125 cycle time
tG125
8
ns
EC_GTX_CLK125 rise time
tG125R
1.0
ns
1
EC_GTX_CLK125 fall time
tG125F
1.0
ns
1
EC_GTX_CLK125 duty cycle
tG125H/tG125
%
1, 2
GMII, TBI
45
55
RGMII, RTBI
47
53
Notes:
1. Timing is guaranteed by design and characterization.
2. EC_GTX_CLK125 is used to generate GTX clock for TSEC transmitter with 2% degradation. EC_GTX_CLK125 duty cycle
can be loosened from 47/53% as long as PHY device can tolerate the duty cycle generated by GTX_CLK of TSEC.
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
13

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