MPC8541CPXAJD(2006) View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MPC8541CPXAJD
(Rev.:2006)

PowerQUICC™ III Integrated Communications Processor Hardware Specifications

Freescale Semiconductor 

DDR SDRAM

6.2 DDR SDRAM AC Electrical Characteristics

This section provides the AC electrical characteristics for the DDR SDRAM interface.

6.2.1 DDR SDRAM Input AC Timing Specifications

Table 13 provides the input AC timing specifications for the DDR SDRAM interface.

Table 13. DDR SDRAM Input AC Timing Specifications

At recommended operating conditions with GVDD of 2.5 V ± 5%.

Parameter

Symbol

Min

Max

Unit

Notes

AC input low voltage

VIL

—

MVREF – 0.31

V

AC input high voltage

VIH

MVREF + 0.31

GVDD + 0.3

V

MDQS—MDQ/MECC input skew per

tDISKEW

—

byte

For DDR = 333 MHz

For DDR < 266 MHz

750

1125

ps

1

Note:

1. Maximum possible skew between a data strobe (MDQS[n]) and any corresponding bit of data (MDQ[8n + {0...7}] if 0 <= n <=

7) or ECC (MECC[{0...7}] if n = 8).

6.2.2 DDR SDRAM Output AC Timing Specifications

Table 14 and Table 15 provide the output AC timing specifications and measurement conditions for the

DDR SDRAM interface.

Table 14. DDR SDRAM Output AC Timing Specifications for Source Synchronous Mode

At recommended operating conditions with GVDD of 2.5 V ± 5%.

Parameter

Symbol 1

Min

Max

Unit

Notes

MCK[n] cycle time, (MCK[n]/MCK[n] crossing)

tMCK

6

10

ns

2

Skew between any MCK to ADDR/CMD

333 MHz

266 MHz

200 MHz

ADDR/CMD output setup with respect to MCK

333 MHz

266 MHz

200 MHz

ADDR/CMD output hold with respect to MCK

333 MHz

266 MHz

200 MHz

MCS(n) output setup with respect to MCK

333 MHz

266 MHz

200 MHz

tAOSKEW

tDDKHAS

tDDKHAX

tDDKHCS

-1000

-1100

-1200

2.8

3.45

4.6

2.0

2.65

3.8

2.8

3.45

4.6

ps

3

200

300

400

—

ns

4

—

ns

4

—

ns

4

MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

16

Freescale Semiconductor

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