S25FL127SABMFI003 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
S25FL127SABMFI003 Datasheet PDF : 142 Pages
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S25FL127S
128-Mbit (16 Mbyte)
3.0 V SPI Flash Memory
Features
CMOS 3.0 Volt Core
Density
– 128 Mbits (16 Mbytes)
Serial Peripheral Interface (SPI) with Multi-I/O
– SPI Clock polarity and phase modes 0 and 3
– Extended Addressing: 24- or 32-bit address options
– Serial Command set and footprint compatible with
S25FL-A,
S25FL-K, and S25FL-P SPI families
– Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
– Normal, Fast, Dual, Quad
– AutoBoot - power up or reset and execute a Normal or
Quad read command automatically at a preselected
address
– Common Flash Interface (CFI) data for configuration
information.
Programming (0.8 Mbytes/s)
– 256- or 512-byte Page Programming buffer options
– Quad-Input Page Programming (QPP) for slow clock
systems
– Automatic ECC -internal hardware Error Correction Code
generation with single bit error correction
Erase (0.5 Mbytes/s)
– Hybrid sector size option - physical set of sixteen 4-kbyte
sectors at top or bottom of address space with all
remaining sectors of 64 kbytes
– Uniform sector option - always erase 256-kbyte blocks for
software compatibility with higher density and future
devices.
Cycling Endurance
– 100,000 Program-Erase Cycles per sector, minimum
Data Retention
– 20 Year Data Retention, minimum
Security features
– One Time Program (OTP) array of 1024 bytes
– Block Protection:
– Status Register bits to control protection against
program or erase of a contiguous range of sectors.
– Hardware and software control options
– Advanced Sector Protection (ASP)
– Individual sector protection controlled by boot code or
password
Cypress 65 nm MirrorBit Technology with Eclipse
Architecture
Supply Voltage: 2.7V to 3.6V
Temperature Range:
– Industrial (-40°C to +85°C)
– Industrial Plus (-40°C to +105°C)
– Automotive AEC-Q100 Grade 3 (-40°C to +85°C)
– Automotive AEC-Q100 Grade 2 (-40°C to +105°C)
Packages (all Pb-free)
– 8-lead SOIC (208 mil)
– 16-lead SOIC (300 mil)
– 8-contact WSON 6 x 5 mm
– BGA-24 6 x 8 mm
– 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint
options
– Known Good Die and Known Tested Die
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-98282 Rev. *I
• San Jose, CA 95134-1709 • 408-943-2600
Revised June 08, 2017
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