MPC8544E(2009) View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MPC8544E
(Rev.:2009)

PowerQUICC™ III Integrated Processor Hardware Specifications

Freescale Semiconductor 

Electrical Characteristics

Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8544E.

B/G/L/OVDD + 20%

B/G/L/OVDD + 5%

VIH

B/G/L/OVDD

GND

GND – 0.3 V

VIL

GND – 0.7 V

Not to Exceed 10%

Notes:

of tCLOCK1

1. tCLOCK refers to the clock period associated with the respective interface:

For I2C and JTAG, tCLOCK references SYSCLK.

For DDR, tCLOCK references MCLK.

For eTSEC, tCLOCK references EC_GTX_CLK125.

For LBIU, tCLOCK references LCLK.

For PCI, tCLOCK references PCI_CLK or SYSCLK.

2. Please note that with the PCI overshoot allowed (as specified above), the device

does not fully comply with the maximum AC ratings and device protection

guideline outlined in Section 4.2.2.3 of the PCI 2.2 Local Bus Specifications.

Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD/BVDD/TVDD

The core voltage must always be provided at nominal 1.0 V (see Table 2 for actual recommended core

voltage). Voltage to the processor interface I/Os are provided through separate sets of supply pins and must

be provided at the voltages shown in Table 2. The input voltage threshold scales with respect to the

associated I/O supply voltage. OVDD and LVDD based receivers are simple CMOS I/O circuits and satisfy

appropriate LVCMOS type specifications. The DDR2 SDRAM interface uses a single-ended differential

receiver referenced the externally supplied MVREF signal (nominally set to GVDD/2) as is appropriate for

the SSTL2 electrical signaling standard.

MPC8544E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

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