PC8240 View Datasheet(PDF) - Atmel Corporation
Part Name
Description
Manufacturer
PC8240 Datasheet PDF : 42 Pages
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The board designer can choose between several types of heat sinks to place on the
PC8240. There are several commercially-available heat sinks for the PC8240 provided
by the following vendors:
Chip Coolers Inc.
333 Strawberry Field Rd.
Warwick, RI 02887-6979
International Electronic Research Corporation (IERC)
135 W. Magnolia Blvd.
Burbank, CA 91502
Thermalloy
2021 W. Valley View Lane
Dallas, TX 75234-8993
Wakefield Engineering
100 Cummings Center, Suite 157H
Beverly, MA 01915
Aavid Engineering
250 Apache Trail
Terrell, TX 75160
800-227-0254 (USA/Canada)
401-739-7600
Internet: www.chipcoolers.com
818-842-7277
Internet: www.ctscorp.com
972-243-4321
Internet: www.thermalloy.com
781-406-3000
Internet: www.wakefield.com
972-551-7330
Internet: www.aavid.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such
as thermal performance at a given air velocity, spatial volume, mass, attachment
method, assembly, and cost.
Internal Package Conduction
Resistance
For the TBGA, cavity down, packaging technology, shown in Figure 4 on page 10, the
intrinsic conduction thermal resistance paths are as follows:
• The die junction-to-case thermal resistance,
• The die junction-to-ball thermal resistance.
Figure 6 depicts the primary heat transfer path for a package with an attached heat sink
mounted to a printed-circuit board.
Figure 6. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
External Re sistance
Radiation Convection
12 PC8240
Internal Resistance
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
External Resistance
Radiation Convection
(Note the internal versus external package resistance)
For this cavity-down, wire-bond TBGA package, heat generated on the active side of the
chip is conducted through the silicon, the die attach and package spreader, then through
the heat sink attach material (or thermal interface material), and finally to the heat sink
where it is removed by forced-air convection.
2149A–HIREL–05/02
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