MSC8122 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

Manufacturer

MSC8122

Quad Digital Signal Processor

Freescale Semiconductor 

Electrical Characteristics

2.2 Recommended Operating Conditions

Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.

Table 3. Recommended Operating Conditions

Rating

Core and PLL supply voltage:

• Standard

— 400 MHz

— 500 MHz

• Reduced (300 and 400 MHz)

I/O supply voltage

Input voltage

Operating temperature range:

• Standard

• Extended

Symbol

VDD

VCCSYN

VDDH

VIN

TJ

TJ

Value

1.14 to 1.26

1.16 to 1.24

1.07 to 1.13

3.135 to 3.465

–0.2 to VDDH+0.2

0 to 90

–40 to 105

Unit

V

V

V

V

V

°C

°C

2.3 Thermal Characteristics

Table 4 describes thermal characteristics of the MSC8122 for the FC-PBGA packages.

Table 4. Thermal Characteristics for the MSC8122

Characteristic

Symbol

FC-PBGA

20 × 20 mm5

Unit

Natural

200 ft/min

Convection

(1 m/s) airflow

Junction-to-ambient1, 2

Junction-to-ambient, four-layer board1, 3

Junction-to-board (bottom)4

Junction-to-case5

Junction-to-package-top6

RθJA

26

RθJA

19

RθJB

9

RθJC

0.9

ΨJT

1

21

°C/W

15

°C/W

°C/W

°C/W

°C/W

Notes: 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.

MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 15

14

Freescale Semiconductor

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