S25FL127SABMFI003 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
S25FL127SABMFI003 Datasheet PDF : 142 Pages
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S25FL127S
6.3.2
WSON Physical Diagram
Figure 39. WND008 — WSON 8-contact (6 x 5 mm) No-Lead Package
SYMBOL
e
N
ND
L
b
D2
E2
D
E
A
A1
A3
K
MIN.
0.55
0.35
3.90
3.30
0.70
0.00
DIMENSIONS
NOM.
1.27 BSC.
8
4
0.60
0.40
4.00
3.40
5.00 BSC
6.00 BSC
0.75
0.02
0.20 REF
0.20 MIN.
MAX.
0.65
0.45
4.10
3.50
0.80
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING CONFORMS TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4 DIMENSION "b" APPLIES TO METALLIZED TERMINAL AND IS MEASURED
BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP. IF THE TERMINAL HAS
THE OPTIONAL RADIUS ON THE OTHER END OF THE TERMINAL, THE
DIMENSION "b" SHOULD NOT BE MEASURED IN THAT RADIUS AREA.
5 ND REFERS TO THE NUMBER OF TERMINALS ON D SIDE.
6. MAX. PACKAGE WARPAGE IS 0.05mm.
7. MAXIMUM ALLOWABLE BURR IS 0.076mm IN ALL DIRECTIONS.
8 PIN #1 ID ON TOP WILL BE LOCATED WITHIN THE INDICATED ZONE.
9 BILATERAL COPLANARITY ZONE APPLIES TO THE EXPOSED HEAT SINK
SLUG AS WELL AS THE TERMINALS.
10 A MAXIMUM 0.15mm PULL BACK (L1) MAY BE PRESENT.
THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS
SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.
PACKAGE
CODE(S)
WND008
DRAWN BY
KOTA
APPROVED BY
LKSU
DATE
13-FEB-17
DATE
13-FEB-17
CYPRESS
Company Confidential
TITLE PACKAGE OUTLINE, 8 LEAD DFN
5.0X6.0X0.8 MM WND008 4.0X3.4 MM EPAD (SAWN)
SPEC NO. 002-18755
SCALE : TO FIT
REV
**
1 2 SHEET OF
Document Number: 001-98282 Rev. *I
Page 42 of 142
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