S25FL127SABMFI003 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
S25FL127SABMFI003 Datasheet PDF : 142 Pages
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6.5.2
Physical Diagram
Figure 43. FAC024 — 24-ball Ball Grid Array (6 x 8 mm) Package
S25FL127S
SYMBOL
A
A1
D
E
D1
E1
MD
ME
N
b
eE
eD
SD
SE
MIN.
-
0.25
0.35
DIMENSIONS
NOM.
-
-
8.00 BSC
6.00 BSC
5.00 BSC
3.00 BSC
6
4
24
0.40
1.00 BSC
1.00 BSC
0.50 BSC
0.50 BSC
MAX.
1.20
-
0.45
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE
PARALLEL TO DATUM C.
7 "SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE
POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" OR "SE" = 0.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" = eD/2 AND
"SE" = eE/2.
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.
9. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK,
METALLIZED MARK INDENTATION OR OTHER MEANS.
THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS
SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.
PACKAGE
CODE(S)
FAC024
DRAWN BY
KOTA
APPROVED BY
BESY
DATE
18-JUL-16
DATE
18-JUL-16
CYPRESS
Company Confidential
TITLE PACKAGE OUTLINE, 24 BALL FBGA
8.0X6.0X1.2 MM FAC024
SPEC NO. 002-15535
REV
**
SCALE : TO FIT
1 2 SHEET OF
6.5.3
Special Handling Instructions for FBGA Packages
Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data
integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.
Document Number: 001-98282 Rev. *I
Page 46 of 142
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