S25FL127SABMFI003 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
S25FL127SABMFI003 Datasheet PDF : 142 Pages
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6.4.2
Physical Diagram
Figure 41. FAB024 — 24-ball Ball Grid Array (8 x 6 mm) Package
S25FL127S
SYMBOL
A
A1
D
E
D1
E1
MD
ME
N
b
eE
eD
SD
SE
MIN.
-
0.20
0.35
DIMENSIONS
NOM.
-
-
8.00 BSC
6.00 BSC
4.00 BSC
4.00 BSC
5
5
24
0.40
1.00 BSC
1.00 BSC
0.00 BSC
0.00 BSC
MAX.
1.20
-
0.45
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE
PARALLEL TO DATUM C.
7 "SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE
POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" OR "SE" = 0.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" = eD/2 AND
"SE" = eE/2.
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.
9. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK,
METALLIZED MARK INDENTATION OR OTHER MEANS.
THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS
SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.
PACKAGE
CODE(S)
FAB024
DRAWN BY
KOTA
APPROVED BY
BESY
DATE
18-JUL-16
DATE
18-JUL-16
CYPRESS
Company Confidential
TITLE PACKAGE OUTLINE, 24 BALL FBGA
8.0X6.0X1.2 MM FAB024
SPEC NO. 002-15534
REV
**
SCALE : TO FIT
1 2 SHEET OF
Document Number: 001-98282 Rev. *I
Page 44 of 142
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