S25FL128S, S25FL256S
4.4 DC Characteristics
Applicable within operating ranges.
Table 4.3 DC Characteristics
Symbol
VIL
VIH
VOL
VOH
ILI
ILO
ICC1
Parameter
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Input Leakage Current
Output Leakage Current
Active Power Supply
Current (READ)
Test Conditions
IOL = 1.6 mA, VCC = VCC min
IOH = –0.1 mA
VCC = VCC Max, VIN = VIH or VIL
VCC = VCC Max, VIN = VIH or VIL
Serial SDR@50 MHz
Serial SDR@133 MHz
Quad SDR@80 MHz
Quad SDR@104 MHz
Quad DDR@66 MHz
Quad DDR@80 MHz
Outputs unconnected during read data return (2)
Min
-0.5
0.7 x VIO
0.85 x VIO
Typ (1)
Max
0.2 x VIO
VIO+0.4
0.15 x VIO
±2
±2
16/22 (3)
33/35 (3)
50
61
75
90
Unit
V
V
V
V
µA
µA
mA
ICC2
ICC3
ICC4
ICC5
ISB (Industrial)
ISB (Industrial Plus)
Active Power Supply
Current (Page Program)
Active Power Supply
Current (WRR)
Active Power Supply
Current (SE)
Active Power Supply
Current (BE)
Standby Current
Standby Current
CS# = VIO
CS# = VIO
CS# = VIO
CS# = VIO
RESET#, CS# = VIO; SI, SCK = VIO or VSS,
Industrial Temp
RESET#, CS# = VIO; SI, SCK = VIO or VSS,
Industrial Plus Temp
Notes:
1. Typical values are at TAI = 25°C and VCC = VIO = 3V.
2. Output switching current is not included.
3. Industrial, Industrial Plus and Extended temperature ranges.
100
mA
100
mA
100
mA
100
mA
70
100
µA
70
300
µA
4.4.1
Active Power and Standby Power Modes
The device is enabled and in the Active Power mode when Chip Select (CS#) is Low. When CS# is high, the device is disabled, but
may still be in an Active Power mode until all program, erase, and write operations have completed. The device then goes into the
Standby Power mode, and power consumption drops to ISB.
Document Number: 001-98283 Rev. *I
Page 28 of 144