S25FL127SABMFI003 View Datasheet(PDF) - Cypress Semiconductor

Part Name

Description

Manufacturer

S25FL127SABMFI003

128-Mbit (16 Mbyte) 3.0 V SPI Flash Memory

Cypress Semiconductor 

S25FL127S

6.1.2

SOIC 8 Physical Diagram

Figure 35. S0C008 — 8-Lead Plastic Small Outline Package (208-mil Body Width)

SYMBOL

A

A1

A2

b

b1

c

c1

D

E

E1

e

L

L1

L2

N

0

01

02

MIN.

1.75

0.05

1.70

0.36

0.33

0.19

0.15

0.51

0°

5°

DIMENSIONS

NOM.

MAX.

-

2.16

-

0.25

-

1.90

-

0.48

-

0.46

-

0.24

-

0.20

5.28 BSC

8.00 BSC

5.28 BSC

1.27 BSC

-

0.76

1.36 REF

0.25 BSC

8

-

8°

-

15°

0-8° REF

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.

3. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm PER

END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 mm PER SIDE.

D AND E1 DIMENSIONS ARE DETERMINED AT DATUM H.

4. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM. DIMENSIONS

D AND E1 ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD

FLASH, BUT INCLUSIVE OF ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF

THE PLASTIC BODY.

5. DATUMS A AND B TO BE DETERMINED AT DATUM H.

6. "N" IS THE MAXIMUM NUMBER OF TERMINAL POSITIONS FOR THE SPECIFIED

PACKAGE LENGTH.

7. THE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO

0.25 mm FROM THE LEAD TIP.

8. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.10 mm TOTAL IN EXCESS OF THE "b" DIMENSION AT

MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE

LOWER RADIUS OF THE LEAD FOOT.

9. THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, THEN A PIN 1

IDENTIFIER MUST BE LOCATED WITHIN THE INDEX AREA INDICATED.

10. LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE

SEATING PLANE.

THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS

SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.

PACKAGE

CODE(S)

SOC008

DRAWN BY

KOTA

APPROVED BY

BESY

DATE

18-JUL-16

DATE

18-JUL-16

CYPRESS

Company Confidential

TITLE PACKAGE OUTLINE, 8 LEAD SOIC

5.28X5.28X2.16 MM SOC008

SPEC NO. 002-15548

REV

**

SCALE : TO FIT

1 2 SHEET OF

Document Number: 001-98282 Rev. *I

Page 38 of 142

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