S25FL127SABMFI003 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
S25FL127SABMFI003 Datasheet PDF : 142 Pages
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S25FL127S
6.2.2
SOIC 16 Physical Diagram
Figure 37. S03016 — 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
0.20 C A-B
0.10 C D
2X
0.33 C
0.25 M C A-B D
0.10 C
0.10 C
SYMBOL
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
L2
N
h
0
01
02
DIMENSIONS
MIN.
NOM. MAX.
2.35
-
2.65
0.10
- 0.30
2.05
- 2.55
0.31
-
0.51
0.27
-
0.48
0.20
-
0.33
0.20
-
0.30
10.30 BSC
10.30 BSC
7.50 BSC
1.27 BSC
0.40
-
1.27
1.40 REF
0.25 BSC
16
0.25
-
0.75
0°
-
8°
5°
-
15°
0°
-
-
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.
3. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm PER
END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 mm PER SIDE.
D AND E1 DIMENSIONS ARE DETERMINED AT DATUM H.
4. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM. DIMENSIONS
D AND E1 ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUSIVE OF ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF
THE PLASTIC BODY.
5. DATUMS A AND B TO BE DETERMINED AT DATUM H.
6. "N" IS THE MAXIMUM NUMBER OF TERMINAL POSITIONS FOR THE SPECIFIED
PACKAGE LENGTH.
7. THE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO
0.25 mm FROM THE LEAD TIP.
8. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.10 mm TOTAL IN EXCESS OF THE "b" DIMENSION AT
MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OF THE LEAD FOOT.
9. THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, THEN A PIN 1
IDENTIFIER MUST BE LOCATED WITHIN THE INDEX AREA INDICATED.
10. LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS
SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.
PACKAGE
CODE(S)
SO3016 SL3016
SS3016
DRAWN BY
KOTA
APPROVED BY
BESY
DATE
24-OCT-16
DATE
24-OCT-16
CYPRESS
Company Confidential
TITLE PACKAGE OUTLINE, 16 LEAD SOIC
10.30X7.50X2.65 MM SO3016/SL3016/SS3016
SPEC NO. 002-15547
REV
*A
SCALE : TO FIT
1 2 SHEET OF
Document Number: 001-98282 Rev. *I
Page 40 of 142
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